Jumbo Roll Food Packing Aluminium Foil For Lamination 8011
1. In the lamination of FPC flexible circuit boards, silicon aluminum foil determines the quality of lamination, and lamination is also the most important process in FPC board factories. Therefore, pay special attention when purchasing FPC laminated silicon-aluminum foil: *Silicone and aluminum plate should be resistant to high temperature and not easy to deform *flatness should be good *no oil leakage *long service life
2. The test method of silicon aluminum foil is as follows: Appearance inspection: The surface is smooth and clean, without cracks, cracks, particles, bubbles, pinholes and foreign impurities. Thickness: Micrometer measurement, take five points to measure, read the data and record. Size: Measure with a ruler or tape measure, take two equal sides to measure, read the data and record. Temperature resistance: The silicon aluminum foil is heated continuously for temperature resistance test (temperature: 185°C; pre-pressing: 10S; molding time: 120S; pressure 100kg/cm2 for continuous operation for 5 ～7 days), no brittleness is allowed. Silicone oil precipitation: the silicon-aluminum foil is continuously heated for temperature resistance test (temperature: 185℃; preload: 10S; molding time: 120S; pressure 100kg/cm2 for continuous operation for 5 -7 days).
3.FPC lamination parameters control: lamination quality depends on the following factors: pressure, temperature, time conformal performance. The commonly used lamination process is carried out according to the curve described below. However, in actual operation, due to the heating up of the heater and the lag of heat transfer, the temperature curve on the actual product is not so regular. Therefore, the lamination parameters should be adjusted according to the respective equipment conditions. Among these parameters, there are some places that should be paid special attention to: In the lamination of flexible boards, a one-step pressure method is generally used, that is, full pressure is applied at the beginning of the lamination. This is the same as the stepwise pressure in rigid boards. The law is different. At the same time, pay attention to the rate of heating, which is generally controlled at 5°C/min. Too fast heating rate is easy to cause bubbles and uneven board surface. When the curing temperature is reached (about 188 ℃), it will enter the heat preservation stage. At this time, the curing time must be controlled (depending on the material of the covering layer, generally between 45-120 minutes). The peeling strength index of the cover layer and the resistance to welding and electroplating are decreased, but too long curing time will cause the aging of the adhesive layer and affect the bending performance of the product. Water cooling should be used in the cooling stage, and the cooling rate should also be controlled within the range of 5℃/min- 10℃/min. The pressure can be released only when the temperature is lower than 45℃.
6.5 Micron Alloy 1235 Roll Aluminium Foil For Cigarette Packaging Aluminum foil is still quite a waste of resources. Many cigarette factories have switched to simple aluminum foil
